DI Erich Thallner Strasse 1
4782 St. Florian am Inn
Austria
Phone : +43 7712 5311 5342
Mail: A.Poenninger@EVGroup.com
Web: www.evgroup.com
MSP-Project Coordinator:
Anneliese Poenninger
Mail: A.Poenninger@EVGroup.com
Phone: +43 7712 5311 5342
EVG is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in nanoimprint lithography and lithography for advanced packaging and MEMS. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.